Samsung, TSMC to Adopt ASML’s $400M EUV Machines, Join Intel in 40% Yield Boost

Samsung Electronics and Taiwan Semiconductor Manufacturing Co. announced plans to install ASML’s latest high‑NA EUV lithography machines over the next several years. They also joined Intel in adopting a new technology change that could raise chip production on these machines by 40 percent. The EUV systems, the only ones of their kind in the world, use powerful laser light to imprint ever smaller patterns on silicon wafers, layer by layer, enabling designers to create more powerful and efficient chips for AI data centers, smartphones, tablets and laptops. The upgrade requires even more powerful light sources with shorter wavelengths, allowing finer features and higher yields. The move signals a broader industry shift toward the expensive, cutting‑edge EUV technology that can cost up to $400 million per machine.